Project 11: Reduced Order Models of Heat Transfer in Packaged Electronic Systems for Efficient Thermal Design, Control of Micro-Scale Systems for Biochemical and Medical Applications, Benjamin Shapiro, University of Maryland

Reduced Order Models of Heat Transfer in Packaged Electronic Systems for Efficient Thermal Design
Students: Pramod Mathai

Analysis of heat transfer in packaged electronics (palm pilots, cell phones, laptops) is computationally expensive. We used model reduction tools to create a library of cheap component models that can be connected into systems and simulated cheaply. This allows optimal thermal design of complex systems.

Full order model (~20000 states)

reduced model
Reduced order model (~2000 states)

Full vs reduced order model of temperature on the board. The model is achieved by interconnecting chip models together, any board layout can be simulated in seconds.